Thread: CPU glitches solved

  1. #31
    Master Apprentice phantomotap's Avatar
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    It is to avoid the galvanic reaction between the copper spreader and the aluminim heat sink.
    Most of the popular pastes don't have an electrolytic base.

    If you are a professional, lapping means mating the sink.

    The slightly dished center of the heat spreader actually helps prevent the thermal interface material from creeping out of the junction and leaving it dry, with heavily degraded thermal performance.
    It does no such thing.

    You couldn't get a copper surface that smooth with a simple file or sanding block in any case; it will always have tiny nodes for the paste to cling.

    I've only been at this for 30+ years professionally.
    O_o

    *insert witty tautology*

    It always makes me laugh when people claim age as being equivalent to experience and wisdom.

    Is your profession actually the design an application of thermal pastes?

    Do you personally track trends in pastes and experimental with them in your own time?

    Want to know how many professional C++ programmers I work with that don't keep their education current?

    All of them; thirty years of experience just makes you old if you don't keep up and doesn't mean that any of it is necessarily applicable.

    Soma

    Second edit failed...

    *sigh*

    I just realized who I responded to.

    Well, I'm off to practice violin.
    Last edited by phantomotap; 03-26-2011 at 08:19 AM. Reason: we don't need no stinking harassment

  2. #32
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    Quote Originally Posted by phantomotap View Post
    It always makes me laugh when people claim age as being equivalent to experience and wisdom.
    Would it help you to know that I am an electronics engineer? Yeah, really.

    Is your profession actually the design an application of thermal pastes?
    Yes the design of themal solutions and application of various thermal products in a production environment was in fact a regular part of my job for a long time.

    Do you personally track trends in pastes and experimental with them in your own time?
    No. I did it in a proper lab with professional grade test equipment...

    Your problem when you try to tackle me with these totally vaccuous arguments is that you assume I'm even stupider than you are... Nice try though.

  3. #33
    (?<!re)tired Mario F.'s Avatar
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    Quote Originally Posted by CommonTater View Post
    There are so many misunderstandings and truly bad ideas floating around out there that I really do get a good chuckle over some of these guy's antics....
    Oh, I fully agree with you. Here's some examples:

    >> Overclockers aren't using it because a) they don't know about it and b) they couldn't buy it even if they did.

    >> You may also need to bring the voltage down one notch... all in the name of not causing a meltdown.

    >> At 4.1ghz you would absolutely need water cooling

    Sadly, these are all your statements. But you are nonetheless absolutely right: There are too many misunderstandings and bad ideas that can give anyone a good chuckle. I chuckled.

    Mr. Engineer-CommonTater-with-30-years-of-experience, if I had a penny for every engineer that just doesn't keep up with the times, it would pay my tuition. Meanwhile, if it dissatisfies you that people over here actually like to think for themselves, investigate and learn, while not falling prey to appeals to authority, I want to remind you there's a milder crowd over here.
    Originally Posted by brewbuck:
    Reimplementing a large system in another language to get a 25% performance boost is nonsense. It would be cheaper to just get a computer which is 25% faster.

  4. #34
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    Quote Originally Posted by Mario F. View Post
    Mr. Engineer-CommonTater-with-30-years-of-experience, if I had a penny for every engineer that just doesn't keep up with the times, it would pay my tuition.
    You're so cute when your nose is all out of joint!
    Last edited by CommonTater; 03-26-2011 at 09:34 AM.

  5. #35
    (?<!re)tired Mario F.'s Avatar
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    You just won the argument! Spin doctors confuse me. I feel exposed and weak.
    Originally Posted by brewbuck:
    Reimplementing a large system in another language to get a 25% performance boost is nonsense. It would be cheaper to just get a computer which is 25% faster.

  6. #36
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    Quote Originally Posted by Mario F. View Post
    You just won the argument! Spin doctors confuse me. I feel exposed and weak.
    Yes, well, maybe if you didn't try to tell people you know more than GOD and actually learned how to say "gee thanks, I didn't know that" once in a while....

  7. #37
    Banned ಠ_ಠ's Avatar
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    I like where this thread is going
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  8. #38
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    Quote Originally Posted by ಠ_ಠ View Post
    I like where this thread is going
    So how was the suspension?
    Learn anything from it?

  9. #39
    'Allo, 'Allo, Allo
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    Quote Originally Posted by CommonTater View Post
    So how was the suspension?
    Learn anything from it?
    I think he created his own networking package, now he's just waiting for you to start interviewing again.

  10. #40
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    Quote Originally Posted by adeyblue View Post
    I think he created his own networking package, now he's just waiting for you to start interviewing again.
    LOL... that would be just my luck...

  11. #41
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    Well, this is a lively thread!

    I can't speak to the thermal paste/grease composition, but Arctic Silver has a shorter effective life than the gray thermal grease that comes with Intel's heatsinks, and it's performance does degrade over about 4 years time, depending on use, climate, operating temp of the cpu, etc. That's well known in the overclocking groups.

    While it makes sense intuitively, to shape the top of the chip's cover, and the heatsink both perfectly flat, that is not always the best shape. The heat across the cpu varies quite a bit in some cpu's, (like the I7), the best shape is simply the one that puts the most contact between the hottest part of the cpu, and the most thermally draining part of the heatsink + thermal paste.

    There is no substitute for actual testing, with an accurate tool.

    I'm in a semi-desert climate, but can't stand the idea of water around my beloved I7, so it has a big air cooled after market device on it. Typically, it runs 24/7, working on a distributed computing project, of massive size (usually Folding@Home). If I wanted to clock it above 3.7, I would need to water cool it. It runs quite happily at 3.6 GHz, (default speed is 2.9 GHz), except on the very hottest Summer days. Then, I want it turned off, anyway.

    Top overclock on my I7 is limited somewhat, because of the cpu model type I have, but it's more than enough to meet my needs.

    I have the I7 in a VERY airy case, with lots of fans, including top mounted fans. (two of them), right over the cpu. These are tremendous for removing heat from the inside of the case. A large volume of laminar air flowing through the case, (from front low, to rear of case, high as mentioned previously), is definitely the best.

    I've tested using a side mounted fan and duct system, to dump air (with a fan and duct), right onto the cpu. It worked fine, BUT it increased the temperature of the cpu, in all three attempts, on all three cases I tried it on. Big surprise, that one!

    Apparently what it helped by bringing in cooler air, it more than hurt, by wrecking the laminar air flow through these cases (which admittedly, have poor air flow through them). These little cases are VERY quiet, but they are NOT much for air flow.

    If you would like to join me in a distributed computing project race of MASSIVE proportion and interest, send me a pm - Overclockers.com has a race with all the other big Folding@Home teams every year -- The Great Chimp Challenge! -- which starts May 5th, but requires some time to get set up with software, and your rigs "tuned" just right!

    Ringers, are more than welcome!


    It's quite possibly THE most fun thing you'll ever do with a computer!! All for the cause of molecular research, targeting both pure research, and specific diseases caused by misfolding (misshapen) proteins.

    For more info on the project:
    Folding@home - Main

  12. #42
    Banned ಠ_ಠ's Avatar
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    Quote Originally Posted by CommonTater View Post
    So how was the suspension?
    Learn anything from it?
    lol no
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  13. #43
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    Quote Originally Posted by ಠ_ಠ View Post
    lol no
    That figures.

    Once an idiot always an idiot.

  14. #44
    (?<!re)tired Mario F.'s Avatar
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    Quote Originally Posted by Adak View Post
    These little cases are VERY quiet, but they are NOT much for air flow.
    Yeah. That can kill about any cooling effort. Air flow is among the most important things to consider when cooling. I just did an experiment and turned both my case fans off. After 2 minutes my idle temps have gone from 35 to 39 where they finally seemed to settle.

    What's your I7, btw?

    As for folding@home, why not? Been, I think, 6 years since I last participated. But I have no ties or affiliation with overclockers.net so don't feel really motivated to join that group.

    edit: hmm... there's a cboard group already. I was sure I remember it being discussed before. But it has been inactive. Moving this to another thread...
    Last edited by Mario F.; 03-26-2011 at 12:22 PM.
    Originally Posted by brewbuck:
    Reimplementing a large system in another language to get a 25% performance boost is nonsense. It would be cheaper to just get a computer which is 25% faster.

  15. #45
    Master Apprentice phantomotap's Avatar
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    Once an idiot always an idiot.
    Direct insults like that are just as much against policy and childish as his behavior.

    Just letting you know...

    Soma

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